Socket: 2066 (LGA)
TDP165W
Cores18th
Threads36
Base rate3.00GHz
Turbo clock4.60GHz
SMTyes (Intel Hyper-Threading)
Storage controllerQuad Channel PC4-23466U (DDR4-2933)
ECC supportNo
Free multiplierYes
remote maintenanceNo
CPU functionsDL Boost, Optane Memory Support, Turbo Boost Max 3.0 (4.80GHz), Turbo Boost 2.0, Hyper-Threading, VT-x, VT-d, Intel 64, SSE4.1, SSE4.2, AVX, AVX2, AVX-512 (2x FMA), EIST, AES-NI, XD bit
Chipset suitabilityX299
scope of deliverywithout CPU cooler
segmentDesktop (HEDT)
architectureCascade Lake
production14nm ++ (Intel)
SteppingL1
introduction2019 / Q4
L2 cache18MB (18x 1MB)
L3 cache24.75MB
Chipset interfaceDMI 3.0, 8GT / s (PCIe 3.0 x4)
PCIe lanes48x PCIe 3.0
Memory max.256GB
Memory bandwidth93.85GB / s
System suitability1 base
Heat spreader contact mediaMetal / soldered
Temperature max.86 ° C
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