DesignSolid State Module (SSM)
Form factorM.2 2280
interfaceM.2 / M-Key (PCIe 4.0 x4)
Read5000MB / s
Write4400MB / s
Read / write IOPS 4K750k / 700k
Memory modules3D-NAND TLC, Toshiba / WD, 96 layers (BiCS4)
TBW1.8PB
Reliability forecast1.77 million hours (MTBF)
ControllerPhison PS5016-E16, 8 channels
Cache1GB (DDR4)
protocolNVMe 1.3
Data protection functions256bit AES
Power consumptionnot specified (maximum), 6.6W (operation), 0.0188W (idle), not specified (sleep mode)
Dimensions80x23.5×11.4mm
particularitiesM.2 heat sink
Manufacturer guaranteefive years or until reaching the TBW
Last price update
Listed since07/10/2019, 3:25 pm
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